astralcooler

Astralcooler GPU Water Block NVIDIA A100 40GB/NVIDIA CMP 170HX/NVIDIA A30 24GB

NVIDIA GPU water block

$239.00
NVIDIA CMP 170HX;All Metal;NVIDIA A100 40GB;NVIDIA A30 24GB
CMP 170HX、 A100 40GB、A330 24GB
Astralcooler  GPU Water Block NVIDIA A100 40GB/NVIDIA CMP 170HX/NVIDIA A30 24GB
Astralcooler  GPU Water Block NVIDIA A100 40GB/NVIDIA CMP 170HX/NVIDIA A30 24GB
Astralcooler  GPU Water Block NVIDIA A100 40GB/NVIDIA CMP 170HX/NVIDIA A30 24GB
Astralcooler  GPU Water Block NVIDIA A100 40GB/NVIDIA CMP 170HX/NVIDIA A30 24GB
Astralcooler  GPU Water Block NVIDIA A100 40GB/NVIDIA CMP 170HX/NVIDIA A30 24GB
Astralcooler  GPU Water Block NVIDIA A100 40GB/NVIDIA CMP 170HX/NVIDIA A30 24GB

COMPATIBLE PLATFORM (PCB)

COMPATIBLE PLATFORM (PCB)
BRAND astralcooler
PRODUCT CATEGORY GPU block
MATERIALS
T2 oxygen‑free copper401 W/mK Cu baseAnti‑corrosion passivationHigh‑purity Cu

Astralcooler NVIDIA CMP 170HX GPU Water Block


Compatible Platforms:


NVIDIA A100 40GB

NVIDIA CMP 170HX

NVIDIA A30 24GB


Cooling Locations:


GPU core, memory, power MOSFETs, inductors, and tantalum capacitors, among other high-heat-generating components.


Cooling Principle:


The high-purity oxygen-free copper baseplate of the graphics card water block covers key high-heat-generating components, including the GPU core, memory, power MOSFETs, and tantalum capacitors. The heat absorbed by the water block is then carried away by the flowing coolant.


Water Block Features


High Thermal Conductivity:


The baseplate is made of T2 oxygen-free copper, with a thermal conductivity of up to 401 W/m·K, improving heat dissipation efficiency and increasing the heat dissipation area.


High-Density Microchannel Jet Design:


Expanded water channel area effectively increases the contact area between the coolant and the baseplate, comprehensively improving the cooling performance of the water block.


Full Metal Coverage:


Full metal cold plate, full-coverage design. Water flows without dead zones, efficiently removing core heat for more thorough cooling.


Lightweight design:


Reduces the weight of the water block and prevents PCB board deformation. A more reliable passivation process ensures faster heat conduction while effectively resisting corrosion and wear.