[Flagship] Water Cooling Solution for Tower Server

🚀 Industrial‑Grade Dual‑Radiator Liquid Cooling Kit

Engineered for Server Workloads from 2000W to 3000W TDP

Designed for ultra‑dense AI servers, large‑scale training clusters, and data‑centre compute nodes with 2000W–3000W system TDP.
Perfectly matched to extreme compute scenarios: 70B–175B LLM full fine‑tuning, multi‑node distributed training, autonomous driving perception at scale, industrial digital twins, and 24/7 scientific supercomputing.

Traditional air cooling – or even single‑radiator liquid cooling – becomes insufficient above 2000W, leading to thermal saturation, performance throttling, node instability, uneven GPU temperatures, and severely shortened hardware life.
This dual‑radiator + distribution plate parallel‑loop liquid cooling system, integrated into a custom full‑tower server chassis, is purpose‑built for sustained 2000W–3000W loads. It completely eliminates cooling bottlenecks, keeps every GPU at peak boost clocks, and ensures your cluster runs 24/7 – stable, quiet, and efficient.

🎯 Target Users

• Research institutions & university AI labs: They need to handle large models with hundreds of billions of parameters (100B+ Parameters) and require local compute clusters for algorithm validation.

• Deep learning hardware integrators (SIs): For business owners dedicated to selling "AI compute black boxes," this solution serves as the top-tier benchmark in their product line. Its hardcore industrial aesthetic (black EPDM tubing, dense radiator arrays) combined with commercial-grade 8K photography showcases unparalleled technical dominance—a visual engine that attracts large-volume orders.

• Autonomous driving & weather simulation enterprises: They process petabyte-scale sensor data and require GPUs to sustain peak compute output at the 3000W level, with stringent demands on system MTBF (Mean Time Between Failures).

✅ Core Advantages

1. Ultra‑High Power Compatibility – Dual‑Radiator Design

Native support for system TDP from 2000W to 3000W. Features a 480×240×100mm ultra‑thick radiator and a 480×120×60mm slim radiator – combined with 12× 120mm fans, delivering significantly more heat dissipation area and airflow than single‑radiator designs. Peak power spikes are no bottleneck.

2. No Thermal Throttling – Full AI Throughput

Oxygen‑free copper micro‑fin water blocks (custom‑fit for CPU/GPU) + dual‑radiator loop. During sustained 2800W load, GPU/CPU temperatures stay stable at 45–55°C. No downclocking, no power limiting, no interrupted training – shorter model iteration cycles.

3. Distribution Plate Parallel Loop – Balanced Multi‑GPU Cooling

A dedicated distribution plate enables fully independent parallel flow to multiple GPUs and the CPU. Eliminates the “hot last card” problem of serial designs. Temperature difference between GPUs is kept within ±2°C – consistent performance in synchronous distributed training.

4. 24/7 Uninterrupted Industrial Reliability

D5 pump & reservoir combo delivers ≥1200 L/h flow and automatic air bleeding. EPDM (ethylene propylene diene monomer) tubing resists extreme temperatures (-40°C to 150°C), corrosion, and ageing. The entire loop is pressure‑tested before delivery – ready for 24/7 operation in labs and data centres.

5. Quiet Operation – Lab & Data Centre Friendly

Thanks to the massive surface area of two radiators, the 12 fans can run at low speeds even under full load. Noise level is kept at ≤42 dBA (at 1m) – far quieter than air cooling. The custom full‑tower server chassis integrates everything into a clean, quiet package, ideal for open‑plan labs and data centre aisles.

📊 Performance vs. Air Cooling & Serial Liquid Cooling

🔧 Seamless Compatibility

Delivery form: Fully integrated system (pre‑assembled in a custom full‑tower server chassis, loop filled and bled). Loose components also available for self‑assembly.

• CPUs: Dual Xeon Platinum / EPYC 9004 series, Threadripper PRO

• GPUs: Up to 4× RTX 4090 / 5090 / A100 / H200 / RTX 6000Ada

• Cooling interface: Standard G1/4” ports; distribution plate with expansion ports

• Control: PWM‑controlled D5 pump, fan hub for centralised speed management

📌 Note

Actual thermal performance may vary depending on chassis airflow, ambient temperature, hardware layout, and usage duration. Evaluate based on your specific system TDP and operating environment.

CPU Block specification

GPU Block specification

Radiator specification(480x240x100mm)

Radiator specification(360x120x30mm)

Radiator specification(480x120x60mm)

Fan specification

Pump specification

Distro Plate specification